Job Responsibilities:
1. Verify that the IC part number, lot number, and marking content are consistent with the order, and check the IC body for scratches or damage.
2. Confirm the correct orientation (pin-1 indicator / positioning mark) of ICs in tape and reel or trays.
3. Review log files automatically generated by programming equipment to verify total programmed quantity, good quantity, and failed quantity match, and check for abnormal error records.
4. Supervise the physical isolation of defective programmed ICs on the production line (usually by hole punching or separate storage), and ensure clear labeling to prevent mixing with good products.
5. Inspect vacuum packaging for air leaks, verify desiccants are effective, and ensure humidity indicator cards show within acceptable ranges.
6. Check that the part number, quantity, batch, and customer part number on carton labels and reel labels match the physical goods and shipping documents.

7. Verify the quantity of ICs in tape and reel or trays by weighing or counting.

Job Requirements:
1. High school diploma or above; electronics-related majors are preferred.
2. Familiar with electronic components and able to accurately identify part number markings on ICs.
3. Able to recognize basic English letters and numbers, and distinguish batch codes.
4. Proficient in using microscopes and magnifying glasses to inspect IC pins and appearance.
5. Excellent patience and attention to detail, as ICs are small and label information is dense.

Job Responsibilities:
1. Operate automatic / semi-automatic IC programmers, taping machines, laser marking machines and other production equipment in strict accordance with Standard Operating Procedures (SOP).
2. According to production work order requirements, correctly select the corresponding programming algorithm files and mass production profiles on the equipment touch screen, and verify the version number to prevent incorrect or missing programming.
3. Responsible for loading and changing materials of ICs to be programmed (wafer ring / tube / tray packaging), as well as unloading and collecting finished products (tape and reel / tray) after programming.
4. Handle common equipment alarms such as material out, material jam, nozzle pick-up failure, etc., with basic troubleshooting and resetting.
5. In case of sudden increase in programming defect rate, abnormal equipment noise, software errors and other conditions, stop the machine immediately and report to the shift leader or engineer without handling complex failures without permission.

6. Perform daily equipment inspections including cleaning, lubrication and wearing parts check, and keep equipment and workbench clean and tidy.

Job Requirements:
1. High school diploma or above, able to adapt to shift work (according to production capacity) and dust-free / ESD-protected workshop environment.
2. Familiarity with electronic components (especially IC chips) is preferred.
3. Experience as an operator in SMT workshop, semiconductor packaging & testing factory or IC programming factory is preferred.

Job Responsibilities:
Industry: Electronic Equipment Manufacturing, Computer Software, Electronics/Semiconductor/Integrated Circuits
1. Complete the development and maintenance of programmer firmware according to customer requirements.
2. Conduct targeted testing and modification of programs.

3. Perform other tasks assigned by supervisors.

Job Requirements:
1. Bachelor's degree or above in electronics-related majors;
2. Proficient in MCU programming and internal module applications (Microchip, TI, NXP, Renesas are mainly used).
3. Proficient in C language (basic knowledge of C#, VB, ASM, Labview is a plus).
4. Able to independently use oscilloscopes, logic analyzers and other related testing instruments.
5. Good coding habits and solid coding architecture concepts.
6. Basic knowledge of circuits and electronics.
7. Basic English skills, able to read technical documents independently.
Work Location: Meigang Road, Gulou District, Xuzhou.

Job Responsibilities:
1. Responsible for designing, developing and optimizing underlying programming algorithms for MCU/MPU and memory chips (Flash, EEPROM) from major semiconductor manufacturers (e.g., Infineon, NXP, ST, Renesas, etc.).
2. Analyze chip datasheets, develop low-level driver code for various communication interfaces (SWD, JTAG, SPI, CAN, UART, etc.), and implement chip erase, program, verify and encryption functions.
3. Optimize programming algorithms for large-capacity code and data in automotive electronics to reduce production cycle time, while ensuring signal integrity and data accuracy during the programming process.
4. Develop BSP (Board Support Package) and low-level hardware drivers (GPIO, Clock, Timer, DMA, etc.) to provide underlying support for communication between the programmer hardware and target chips.
5. In-depth understanding of target chip memory mapping (Flash, RAM), handle different addressing modes and data storage formats to ensure correct placement of programming data.
6. Provide necessary low-level software adaptation support for programming chips with complex protocol stacks (e.g., AUTOSAR MCAL configuration, CAN/LIN protocol stacks).
7. Collaborate with PC-side upper-computer software engineers to define communication protocols, assist in debugging USB/Ethernet communication interfaces, and ensure accurate instruction interaction between the programmer and PC.
8. Compile technical documents for low-level drivers, programming algorithm interface specifications, and programming guides for specific chips (especially automotive-grade chips).
9. Evaluate the application feasibility of new programming interface standards (such as High-speed SPI, 100Base-T1, etc.) in production line programming scenarios.

Job Requirements:
1. Bachelor's degree or above in Electronics, Computer Science, Automation or related fields.
2. More than 3 years of embedded software development experience; experience in semiconductor vendors (FAE/AE), programmer manufacturers, or automotive electronics Tier 1 suppliers is preferred.
3. Proficient in C language and skilled in using assembly language for low-level debugging.
4. Proficient in embedded software development based on ARM Cortex-M/R/A or dedicated automotive electronics cores (e.g., TriCore, PowerPC).
5. In-depth understanding of MCU boot process, Flash programming model and memory mapping.
6. Skilled in using oscilloscopes and logic analyzers for low-level timing analysis and problem troubleshooting.
7. Familiar with automotive electronics supply chain: understand AEC-Q100 standard for automotive-grade chips, familiar with HSM security mechanism and common automotive communication protocols (CAN/CAN FD, LIN).
8. Manufacturer cooperation experience: experience in cooperating with technical departments of NXP, Infineon, Renesas, ST, Microchip to resolve chip Errata or low-level driver bugs is preferred.