
EPROM, EEPROM, Serial PROM, Flash Memory
PLD/CPLD/FPGA, MPU/MCU
eMMC, UFS, SPI NAND, SD NAND, etc.
DIP, SDIP, SOP, MSOP, QSOP, SSOP, TSOP, TSSOP
PLCC, QFP, CASON, QFN, MLP, MLF
BGA, CSP, SOT, DFN, WLCSP, etc.
Major US, Japanese, Taiwanese and European brands (see HiloMax weekly updated website for details)

Dot marking in various colors or up to 4-character printing; Equipment: laser marker / automatic printer
Appearance inspection for TSOP, BGA, QFN, QFP packages using proprietary 3D L/S technology, accurately detecting marking errors, pin offset and other defects
Stocked various carrier and cover tapes for all IC packages; strict appearance inspection before unpacking/reeling; customized carrier tape available
Baking and burn-in testing per customer requirements; special vacuum packaging with humidity indicator cards
Custom test systems for special customer products; complete turnkey solutions for IC mass production
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Average Cycle Time: 3.0 sec/unit
Operating Efficiency: 95%
Operating Time: 12 hours/day
HiloMax Test Center is ISO 9001 and ISO/TS 16949 certified. Supported by ERP and MES systems, all processes are strictly controlled to ensure optimal IC test quality, accurate output and on-time delivery.
ISO 9001 Certification
ISO/TS 16949 Certification
ERP Management System
MES Manufacturing Execution System
