Optical Inspection System - Die-Bond Inspection - Die Attach Measurement

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Package Inspection

HL-660 Die-Bond Optical Measurement System

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The HL-660 is a high-precision fully automatic optical measurement system designed for IC mounting processes. Integrating a high-resolution motion stage, multi-magnification vision system and intelligent algorithms, it performs non-contact precision measurements of critical parameters including post-mounting position, tilt, rotation and adhesive layer thickness. Equipped with a rotating spindle and various special light sources, it is suitable for advanced packaging architectures such as single-IC, multi-IC and stacked-IC configurations, serving as core inspection equipment to ensure mounting quality.

Key Highlights

High-Precision Measurement: X/Y ±0.1μm, Z ±0.01μm resolution; epoxy thickness ±0.5μm, die position ±2μm, die rotation ±0.1°.

Auto Magnification Switching: 5X/20X/100X auto-change with progressive positioning, from low-mag search to high-mag measurement automatically.

Rotating Spindle Design: Enables multi-angle accurate measurement with no blind spots, ideal for complex structures.

Multiple Special Light Sources: Adapt to various IC materials and surface features for clear imaging.

Wide Process Compatibility: Supports single-die, multi-die and stacked-die packages for diverse attach processes.

High-Efficiency Measurement: Fully automated from positioning, auto-focus to multi-parameter measurement; ~180 sec per cycle.

Power & Automotive Die Attach QC

For high-reliability power devices and automotive electronics packaging. Precisely controls die tilt and epoxy thickness uniformity to ensure thermal performance and long-term reliability.
Stacked Die & Heterogeneous Integration Control

For advanced packages such as 3D stacking and SiP. Accurately measures shift, tilt and gap of multi-layer IC, providing critical data for high-density interconnect verification.
High-Precision Die Attach R&D & Optimization

For R&D and process engineering teams. Statistical analysis of measurement data optimizes bonder pressure, temperature and dispensing parameters to improve yield.

Intelligent Vision Measurement & Process Analysis Platform

One-Touch Multi-Parameter Auto Measurement: Integrates all measurement items; auto positioning, focusing, magnification switching and synchronous multi-parameter measurement & judgment.
Real-Time SPC Monitoring: Built-in statistical process control module monitors key parameters in real time with automatic alarm for abnormalities, enabling preventive quality management.
Recipe Management & Fast Changeover: Saves measurement parameters, lighting settings and tolerance standards as independent recipes for one-click switching to support multi-product production.
Data Traceability & Comprehensive Reporting: Automatically generates reports with measurement data, NG images and statistical charts; supports data export to meet traceability requirements.

Specifications

Category	Item	Specification
Mechanical	Dimensions (W×D×H)	1120 × 1320 × 1700 mm
Mechanical	Weight	1550 kg
Utility	Power	220 VAC, 60 Hz, 5 A, 1.1 kW
Utility	Vacuum	0.6 MPa, 55 L/min
Motion Stage	Stage Size	Width 15–125 mm, Length 140–300 mm
	X/Y Travel	400 × 140 mm
	Stage Resolution	X/Y: ±0.1 μm, Z: ±0.01 μm
	Supported Substrates	Leadframe, Substrate
Optical System	Camera	5 MP, 1” sensor
	Magnification	5X, 20X, 100X auto-switching
	Pixel Resolution	5X: 1 μm/pixel 20X: 0.25 μm/pixel
Measurement Accuracy	Epoxy Thickness	±0.5 μm
	Die Tilt	±0.5 μm
	Adhesive Layer Height	±1 μm
	Die Position (Shift)	±2 μm
	Die Rotation	±0.1°
Measurement Range	Die Size	25×25 ~ 800×800 mils
Measurement Range	Die Thickness	2 ~ 50 mils
Efficiency	Cycle Time	Approx. 180 sec per measurement
Mechanical Features	Base	High-stability base
	Spindle	Rotating spindle
	Illumination	Multi-mode specialized lighting
Package Support	Package Types	Single-die, Multi-die, Stacked-die