Optical Inspection System - Wire-Bond Inspection - Wafer Measurement

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Package Inspection

HL-625 Wire-Bond Optical Measurement System

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The HL-625 is a high-precision fully automatic optical measurement system designed for the Wire-Bond process in semiconductor packaging. Using high-resolution optical modules and a precision motion stage, it enables fast, automated inspection of parameters such as bond ball position, wire arc profile, and critical gaps. Equipped with a vibration-damping and anti-vibration platform to ensure measurement stability, it is professional equipment for quality control in the bonding process.

Key Highlights

High-Precision Measurement: Stage resolution X/Y ±0.1μm, Z ±0.01μm; optical resolution up to 0.05μm/pixel for sub-micron measurement needs.

Intelligent Measurement Flow: Auto magnification switching and progressive positioning, from low-mag search to high-mag measurement automatically for higher efficiency.

Stability & Reliability: Professional anti-vibration stage effectively isolates external interference, ensuring consistent long-term measurement accuracy.

Wide Process Compatibility: Supports single-die, multi-die and stacked-die packages to meet various bonding measurement requirements.

Flexible Expansion: Customizable measurement items and workflows; wire profile comparison can be added to adapt to evolving processes.

In-Line Wire-Bond Process Quality Control

Used for post-bonding inspection on packaging lines, quickly screening defects such as ball shift, excessive loop height and spacing issues, while monitoring process stability in real time.
Packaging Reliability Verification & Final Inspection

For QA departments to perform sampling or full inspection of finished packages, using high-precision measurements to verify compliance with reliability specifications.
Process Development & Parameter Optimization

For R&D and process engineering teams, providing data-driven support for bonding parameter optimization through precise measurement and statistical analysis of large sample sets.

Intelligent Vision Measurement & Data Analysis Platform

One-Touch Intelligent Measurement: Integrates auto-focus, multi-magnification switching and progressive positioning; fully automatic from search to high-precision measurement after recipe selection.
Real-Time SPC Monitoring: Built-in statistical process control module plots real-time control charts for key parameters with automatic anomaly trend alerts for preventive quality management.
Custom Measurement & Analysis: Supports user-defined measurement logic and judgment criteria; wire profile comparison can be added to match actual contours with standard drawings.
Data Management & Traceability: Automatically generates inspection reports with defect images, data lists and charts in TXT/XML/CSV; SECS/GEM interface optional for MES integration.

Specifications

Category	Item	Specification
Mechanical	Dimensions (W×D×H)	1200 × 1220 × 1700 mm
Mechanical	Weight	1460 kg
Utility	Power	220 VAC, 60 Hz, 10 A, 1 kW
Utility	Vacuum	0.6 MPa, 55 L/min
Stage & Motion	Substrate Size	Width 25–100 mm, Length 140–300 mm
	X/Y Travel	400 × 140 mm
	Stage Resolution	X/Y: ±0.1 μm, Z: ±0.01 μm
	Supported Substrates	Leadframe, Substrate
Optical System	Camera	5 MP, 1” sensor
	Optical Resolution	5X: 1 μm/pixel 50X: 0.1 μm/pixel 100X: 0.05 μm/pixel
	Auto Focus	Supported
Core Measurement	Ball Measurement (X/Y)	10–60 μm
	Ball Measurement (Z/Thickness)	1–800 μm
	Loop / Gap Measurement	1–5000 μm
	Peak Search Area	2500 × 2000 μm
Measurement Items	Position	Ball on Pad X/Y, Ball on Finger X/Y, Ball on Ball X/Y, Stitch on Finger X/Y, SSB
	Height / Thickness	Ball Thickness, Fixed Loop Height (1st/2nd BONO), Search Loop Height, Kink Height
	Gap	Die Gap (Edge Height), Loop Gap (Wire Gap)
Software & Output	HMI	Monitor, Keyboard, Joystick
	Report Format	TXT, XML, CSV
	Communication	SECS/GEM (optional)
Package Support	Package Types	Single Die Bond, Multiple Die Bond, Stacked Die Bond
Optional Module	High-Magnification Lens	Metal frame, adjustable