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Package Inspection

HL-640 Die Bond / Wire Bond Fully Automatic Optical Inspection System

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The HL-640 is a high-performance fully automatic optical inspection system designed for IC packaging processes, integrating appearance defect inspection for both Die Bond and Wire Bond, two critical packaging steps. Equipped with dual high-speed cameras and AI learning algorithms, plus an adaptive smart track, it accurately identifies various packaging defects to enable automated quality screening on production lines.

Key Highlights

AI Learning Capability: Intelligent learning algorithm understands normal process variations, accurately identifies real defects, and improves inspection stability and accuracy.

Dual-Camera Inspection Platform: Equipped with two independent high-speed imaging systems (5MP & 25MP), supporting simultaneous or sequential inspection for higher efficiency.

Adaptive Smart Track: Automatic width adjustment supports various leadframe/substrate sizes, enabling fast changeover for multi-product production.

Comprehensive Defect Coverage: Automatically detects wire bonding issues, poor solder joints, die shift, lead deformation, contamination and other packaging defects.

Full Automation Workflow: Integrated auto loading/unloading, dual-station inspection and report generation for unmanned operation from input to sorting.

In-Line Full Inspection for Semiconductor Packaging Line

Performs high-efficiency, stable and traceable in-line inspection after die attach and wire bonding, strictly preventing defective products from flowing downstream.
Zero-Defect Screening for High-Reliability Products

Ideal for automotive electronics, industrial control and other zero-defect fields. AI algorithms ensure products meet strict reliability requirements.
Process Monitoring & Big Data Optimization

Supports process and quality teams by analyzing inspection data, providing insights for parameter optimization and yield improvement.

Intelligent Inspection Management Platform

AI Model Training & Continuous Learning: Intuitive training tools allow users to import sample data, enabling the system to self-learn and optimize defect recognition models.
Full-Process Data Traceability: Automatically records inspection results, defect images and production batches, generating detailed reports to meet quality traceability requirements.
Real-Time Production Dashboard: Dynamically displays machine status, real-time yield, defect distribution and other key KPIs for efficient on-site management.
Recipe Management: Saves inspection parameters as independent recipes for one-click switching, supporting multi-product production.

Specifications

Category	Item	Specification
Mechanical	Dimensions (W×D×H)	1600 × 1050 × 1420 mm
Mechanical	Weight	1170 kg
Power	Voltage	220V AC
Power	Rated Power	2500W (to be confirmed)
Motion System	Travel Range	X-cam: 100mm / Track: 1000mm Y: 100mm Z: 12mm
	Stage Size	100 × 300 mm
	Max. Speed	X: 50 mm/s Y: 30 mm/s Z: 5 mm/s
	Resolution	X/Y: 1μm Z: 0.5μm
	Positioning Accuracy	X/Y: ±2μm Z: ±1μm
	Z Repeatability	±1μm
Vision System	Camera	5MP & 25MP high-resolution cameras
	Lens Magnification	1X / 2X optional
	FOV	Max: 5.2 × 3.8 mm High-res: 3.1 × 2.3 mm
	Pixel Resolution	Up to 0.775μm/pixel
Core Software	Platform	HILO System
Inspection	Process Coverage	Die Bond, Wire Bond
Inspection	Defect Types	Missing wire, poor bond, die shift, lead deformation, contamination, IC scratch, tail abnormality, broken wire, etc.
Automation	Handling	Auto load-in, dual-station inspection, auto unload & sorting