High-Temperature Test System - IC Aging & HTOL - Reliability Test

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Automated Test System

HT-288 High-Throughput High-Temperature Test System

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HT-288 is a high-performance high-temperature test system designed specifically for IC package reliability verification. It supports up to 288 devices under test (DUTs) in parallel and can run 3 different packages and test items simultaneously. The system features forced horizontal air circulation and a specialized air duct design to ensure a stable and uniform temperature distribution. Combined with multiple intelligent safety protection mechanisms, it provides an efficient, precise and secure production-level solution for high-temperature burn-in, characteristic testing and reliability verification of IC.

Key Highlights

High-Throughput Parallel Testing: Supports up to 288 DUT parallel tests, capable of running 3 different packages and test items simultaneously, greatly improving test efficiency.

Precise Temperature Uniformity Control: Forced horizontal air circulation with special air duct design ensures empty chamber temperature uniformity of ±1.5~2%, guaranteeing consistent test conditions for all devices.

Wide Temperature Range: Temperature range from RT+20℃ to 250℃, meeting high-temperature test and burn-in requirements for various IC.

Multiple Safety Protections: Integrated hardware safety mechanisms including over-temperature automatic power-off and over-current protection for electric heating, fully ensuring product and equipment safety.

High-Quality Insulation Structure: 10cm thick high-efficiency insulation layer, heat-resistant and corrosion-resistant, effectively preventing heat penetration for energy saving and stability.

Wide Compatibility: Supports mainstream packages such as DIP, QFP, QFN, BGA, WLCSP, and adapts to various IC types including I2C, SPI, NAND.

Test System Integration: Can be equipped with ICT-192 tester, providing multiple sets of VCC/VPP/PMU and high-speed I/O to complete functional high-temperature testing.

High-Temperature Burn-in and Lifetime Test for Mass-Produced IC

Suitable for reliability screening after IC mass production. Long-term high-temperature power-on burn-in accelerates the exposure of early failure defects, ensuring long-term reliability of shipped products.
Multi-Type, Small-Batch R&D Verification

Ideal for R&D and pilot production stages. With multi-task parallel capability, it can simultaneously conduct high-temperature characteristic comparison and limit parameter verification for different IC models, improving R&D efficiency.
Harsh Environment Simulation for Automotive Electronics & Industrial Control IC

Designed for automotive electronics and industrial control IC with strict operating temperature requirements. It simulates actual high-temperature working environments for functional and performance testing, verifying stability under extreme conditions.

Intelligent Temperature Control & Production Management Software

Real-Time Temperature Field Monitoring & Recording: 6 sets of temperature sensors (top, middle, bottom) monitor temperature distribution in real time, paired with a paperless recorder to generate complete temperature curves and test logs for traceability and analysis.
Multi-Project Parallel Temperature Management: Supports independent temperature profile settings for different test zones or product carriers to meet parallel testing requirements.
Intelligent Safety Monitoring & Alarm: Integrates all safety sensor status; triggers instant alarms and executes preset protection procedures automatically in case of abnormality.
Test Recipe Management: Saves parameters such as temperature profiles and test times as encrypted recipes for one-click recall to ensure process consistency.
Data Logging & Reporting: Automatically records test process data and generates detailed reports to support quality analysis and production management.

Specifications

Category	Item	Specification
Capacity & Flexibility	System Capacity	Max 288 DUT
Capacity & Flexibility	Test Flexibility	Supports simultaneous testing of 3 different packages and test items
Temperature Performance	Temperature Range	RT+20℃ ~ 250℃
	Temperature Uniformity	±1.5 ~ 2% (empty chamber test)
	Temperature Sensors	6 total (2 top, 2 middle, 2 bottom) with paperless recorder
	Circulation System	Forced horizontal air circulation with special air duct design
Control & Safety	Control System	PID microcomputer touch control, CA(K) sensor, honeycomb heater
Control & Safety	Safety Protection	Over-temperature auto power-off, electric over-current protection
Structure & Material	Inner Chamber Material	SUS304 stainless steel
	Insulation Material	High-density rock wool, 10cm thickness
	View Window	2 pcs × 280×480mm glass window
	Machine Structure	Double side-by-side doors, 4 adjustable feet + 4 casters
Electrical	Power Supply	3-phase 380V 50/60Hz
Electrical	Power	11kW
Dimensions	Inner (W×H×D)	1500 × 1000 × 600 mm
Dimensions	Outer (W×H×D)	2070 × 1820 × 850 mm
Compatibility	Package Support	DIP, SDIP, SOP, SSOP, TSOP, PLCC, QFP, QFN, SON, BGA, WLCSP, etc.
	IC Protocol	I2C, SPI, ISA, NAND(SDR), SPI-NAND, etc.
	Compatible Tester	Works with ICT-192, providing multi-channel VCC/VPP/PMU and high-speed I/O