HL-900I Universal IC Test System - ATE Equipment

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Automated Test System

HL-9001 Fully Automatic Universal IC Testing System

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HL-9001 is a high-performance fully automatic IC testing system built on comprehensive production experience, specially designed for microcontrollers (MCUs) and various small-capacity ICs. Supporting four input/output methods including Tray, Tape, Tube and Bowl Feeder, it achieves true “universal” platform capability. Equipped with high-precision visual positioning and motion control, it delivers up to 3000 UPH, can host 6 test units and supports up to 96 test sockets, providing a one-stop solution for high-efficiency, high-precision mass testing.

Key Highlights

Versatile Material Handling: Supports four feeding & discharging methods including Tray, Tape, Tube and Bowl Feeder, flexibly adapting to various packages and greatly improving production line compatibility.

High-Precision Vision Positioning: Equipped with a 1.3MP upper camera and a 3.2MP lower camera, accurately identifying and handling micro ICs as small as 2×2mm with high placement accuracy and effectively reducing defect rates.

Excellent Production Efficiency: Maximum capacity up to 3000 UPH, capable of connecting 6 testers simultaneously and supporting up to 96 test sockets, meeting extreme throughput demands for mass production.

Wide Device Compatibility: Supports interface chips such as I2C, SPI, ISA, NAND(SDR), SPI-NAND, and mainstream packages including DIP, SDIP, SOP, SSOP, TSOP, PLCC, QFP, QFN, SON, BGA, WLCSP.

Optional Marking Function: Can be equipped with an ink printing module to support dots, numbers and letters, integrating testing and marking in one process.

Stable & Reliable Design: Driven by high-precision ball screws and servo motors, with X/Y/Z axis resolution of 0.0025mm, ensuring long-term operational accuracy and stability.

Mass Final Test (FT) for MCUs and Low-Capacity ICs

Suitable for mass production final testing of MCUs and memory chips in consumer electronics and IoT devices. High UPH and parallel multi-socket testing enable fast and stable screening and grading of good products.
Flexible Production for Multi-Type, Small-Batch

Ideal for R&D prototypes, industrial control and automotive electronics with diversified production. Universal feeding and quick changeover allow efficient and convenient switching between ICs of different packages and models.
High-Precision Testing for Miniaturized Components

Designed for ultra-small packages such as WLCSP and 01005 requiring extremely high placement accuracy. High-precision vision and motion systems ensure damage-free handling, with optional 2D/3D inspection to further guarantee incoming material quality.

Intelligent Test Management Software

Graphical User Interface: Intuitive visual interface displays real-time socket status, production progress and alarm information for easy operation.
Multi-Task Parallel Management: Supports simultaneous control of multiple testers and test programs with flexible production scheduling.
Data Logging & Traceability: Automatically records test results, timestamps and batch data for each IC, generating detailed reports for quality traceability.
Fast Recipe Switching: Saves test parameters for different products as recipes for one-click recall, reducing changeover time.
Equipment Status Monitoring: Real-time tracking of machine status, alarm logs and maintenance reminders to ensure stable line operation.

Specifications

Category	Item	Specification
Basic Info	System Model	HL-9001 Automatic Test System
Capacity & Efficiency	Max Throughput	Up to 3000 UPH
	Tester Capacity	Up to 6 testers
	Socket Support	Up to 96 test sockets
Vision System	Top Camera	1.3 MP, positioning accuracy ±0.02mm
	Bottom Camera	3.2 MP, positioning accuracy ±0.01mm
	Image Processing Speed	0.03 sec per device
	Min. Recognizable Size	2×2 mm IC package
Motion System	Transmission	High-precision ball screw + linear guide
	Drive System	High-precision servo motor
	Resolution	X/Y/Z: 0.0025mm; U-axis: 0.15°
Material Handling	Tray	Auto Tray, 25-tray capacity; manual tray optional
	Tape	Electronic feeder 8–44mm (up to 4 sets); auto output 8–44mm, heat seal / self-adhesive tape optional
	Tube	Tube input available (optional)
	Bulk Feed	Supports bowl feeder for loose components
Marking Function	Ink Printing	Built-in ink module supports dots, numbers and letters
Other Functions	NG Bin	Automatic reject collection
Electrical & Environment	Power Supply	AC power (details upon request)
	Air Supply	0.6 MPa, 45 L/min
	OS	Windows 7
	Interface	Ethernet / USB 3.0
Physical	Dimensions (W×D×H)	1055mm×1370mm×1645mm (with beacon) 1378mm (without beacon)
Physical	Net Weight	880 kg
Compatibility	IC Protocol	I2C, SPI, ISA, NAND (SDR), SPI-NAND, etc.
Compatibility	Package Support	DIP, SDIP, SOP, SSOP, TSOP, PLCC, QFP, QFN, SON, BGA, WLCSP, etc.