AT3-350B Auto Programmer - 3500 UPH - 64 Sockets

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Automatic Programming System

AT3-350B Automatic Programming System

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The AT3-350B is a fully automatic system developed by Hilosystems Semiconductor specifically for high-volume, high-density IC programming; equipped with a 4-nozzle pick-and-place head, it achieves an actual output of up to 3,500 UPH (tape-to-tape) and uses in-house motion control and vision positioning technology to ensure high speed and precision, while supporting integration of up to 4 ALL-200G/300G series programming cores and a maximum of 64 parallel programming sockets covering nearly all programmable devices including eMMC, NAND/NOR Flash, MCU/MPU, FPGA and others, with flexible combinations of Tray, Tape and Tube input/output and optional ink/laser marking and 3D inspection modules for an all-in-one, expandable-on-demand solution.

Key Highlights

High Throughput & Precision: 4 nozzles, Reel to Reel up to 3500 UPH, placement accuracy ±0.01mm, stable yield.

Strong Compatibility: Supports up to 4 programmers (ALL-200G/300G2/GU2), max 64 sockets; supports 1.8V low-voltage devices, full-pin auto-detection & reverse protection.

Precision Vision Positioning: Dual cameras (upper 1.3MP / lower 3.2MP), accuracy ±0.02mm/±0.01mm, imaging speed 0.03s/unit, supports WLCSP/QFN micro-packages.

Intelligent Software: Graphical UI, one-click parameter recall, real-time monitoring & reports, MES integration ready, supports unattended production.

Flexible Material Handling & Expansion: Dual Tray tracks (zero changeover), Tape feeder 8–44mm, Tube 8–44mm adjustable; optional ink/laser marking, 2D/3D inspection.

Compact & Energy-Saving: Main unit 1470×1270×1425mm (1840mm with monitor, 1695mm with signal tower), power 2.5kW, air 45L/min, modular design for easy maintenance.

Specifications

Item	Specification
Throughput	Reel to Reel up to 3500 UPH; Tray to Tray up to 3000 UPH
Pick-and-Place Head	4 nozzles
Supported Programmers	ALL-200G/300G/300G2/300GU2 (max. 4 units)
Max. Programming Sockets	64 (4 units × 16 sockets)
Material Handling	Tray: dual track, 20 trays each, non-stop exchange Tape: 8–44mm feeder Tube: 8–44mm adjustable
Vision System	Upper camera: 1.3MP (socket alignment) Lower camera: 3.2MP (IC alignment) Supports components down to 1.5×1.5mm
Marking (Optional)	Inkjet module (372/373), Laser marking module (Hilo Laser)
Inspection (Optional)	Pin check, MARKING recognition, 2D/3D appearance inspection
MES Integration	Customizable
Power	220~240V single-phase, 50–60Hz, 2.5 kW (max)
Air Supply	0.6 MPa, 45 L/min
Dimensions (W×D×H)	1470mm (1840mm with monitor) × 1270mm × 1425mm (1695mm with signal tower)

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